The Japanese manufacturer of electronic devices NEC has reported the development of a new bioplastic from cashew nut shell, the more resistant. http://thechemistrysideoftheforce.blogspot.com/
The new bioplastic using up to 70% of materials from the remains of plants, pulp and cardanol, the compound ontiene cashew shells yque offers greater resistance to the product, making it ideal for use in the manufacture of electronic devices.
According to NEC, its new bioplastic is twice as heat resistant resin polylactic acid (PLA) and 1.3 times more than the resins of cellulose acetate (CA), offers greater resistance to water, and requires less than half the time when mold. The new bioplastic, whose development will be formally announced at the meeting of the Chemical Society of Japan, Tsukuba University next August 31 will not be ready for commercial application until 2013.
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