ACF (Anisotropic conductive film) or ACF tape is an epoxy
adhesive system used by electronics industry to make electrical and mechanical
connections from drive electronics to substrates.
ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).
The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.
ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.
ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.
Our special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.
During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductives particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.
This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).
The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.
As the epoxy cures and conductive particles are trapped into permanent compressed form.
The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
ACF has for many years, been used in glass display applications. Recently, it is also becoming widely used in COF and COB areas.
Examples of ACF applications.
- TAB Bonding (TCP-PCB / TCP-LCD)
- COG Bonding (IC-LCD)
- COB Bonding (IC-PCB)
- COF Bonding (IC-FPC)
- Plasma Display (FPC-PDP)
- Flip Chip Package
ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).
The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.
ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.
ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.
Our special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.
How does it work ?
During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductives particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.
This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).
The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.
As the epoxy cures and conductive particles are trapped into permanent compressed form.
The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
Applications
ACF has for many years, been used in glass display applications. Recently, it is also becoming widely used in COF and COB areas.
Examples of ACF applications.
- TAB Bonding (TCP-PCB / TCP-LCD)
- COG Bonding (IC-LCD)
- COB Bonding (IC-PCB)
- COF Bonding (IC-FPC)
- Plasma Display (FPC-PDP)
- Flip Chip Package
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